Intel and Samsung actively deploy 3.5D semiconductor packaging technology

Intel and Samsung, the world's two largest semiconductor giants, are actively developing 3.5D semiconductor packaging technology. Kevin O'Buckley, Intel's senior vice president, said that their 3.5D technology is based on a substrate with a silicon bridge, aiming to provide better signal integrity performance. Samsung has demonstrated its roadmap for 3.5D configuration, planning to use 1.4nm chips stacked on 2nm chips in 2027.