Samsung Electronics makes progress in AI memory chips

Samsung Electronics has begun to make progress in narrowing the gap with rival SK Hynix after a series of setbacks in developing memory chips that are critical to the artificial intelligence (AI) market. Samsung has received long-awaited approval from Nvidia for its high-bandwidth memory (HBM) chip HBM3, and expects the next-generation HBM3E to be approved within 2 to 4 months. Samsung said at its second-quarter earnings conference on July 31 that the fifth-generation 8-layer HBM3E product is currently undergoing customer evaluation and is scheduled to be mass-produced in the third quarter of this year.