UMC and Qualcomm jointly develop HPC chips, which are expected to be mass-produced and shipped in 2026

According to the supply chain, UMC has started cooperation with Qualcomm on HPC advanced packaging, mainly targeting the AI ​​PC, automotive and AI server markets. UMC's first batch of interposer 1500 capacitors have passed Qualcomm's electrical tests and are currently in trial production, with mass production expected in the first quarter of 2026. This cooperation is expected to bring new business growth points to UMC.