TSMC announced that it will invest $100 billion in the United States to build cutting-edge chip manufacturing facilities in the next few years

According to the latest news, TSMC Chairman Wei Zhejia announced on March 3 that the company plans to invest $100 billion in the United States in the next few years to build advanced chip manufacturing facilities. TSMC plans to build five new wafer fabs in the United States, of which three semiconductor manufacturing plants have been committed to construction. In addition, three new semiconductor plants, two advanced packaging plants and one R&D center will be added.