Innosilicon's third-generation semiconductor power module packaging and testing project completed

Innosilicon's third-generation semiconductor power module packaging and testing project with an annual output of 1.2 million sets was completed in May 2024, and the acceptance of soil and water conservation facilities was completed in the same month. According to data, Innosilicon's Wuxi "third-generation semiconductor module packaging and testing project" manufacturing base has a total investment of 800 million yuan, a construction area of ​​about 30,000 square meters, and a planned annual production capacity of 1.2 million sets of automotive-grade modules.