Jingneng Microelectronics' orders are scheduled until the end of September

The first phase of Jingneng Microelectronics' automotive-grade semiconductor packaging and testing base (Wenling) and the annual production of 260 million power semiconductor device packaging projects have been put into production, with orders placed until the end of September. This is an automotive-grade Si/SiC (silicon/silicon carbide) device advanced packaging production line, which is expected to produce 260 million to 390 million products per year, with an annual output value growth of more than 50% year-on-year.