Lingming Photonics and Huayu Automotive Electronics jointly develop a new pure solid-state LiDAR

Lingming Photonics and Huayu Automotive Electronics have developed a new pure solid-state LiDAR, which uses large-size silicon wafer bonding technology to achieve highly integrated chips, making it possible to miniaturize the LiDAR while ensuring its excellent range-finding performance and environmental perception accuracy. This new LiDAR will help improve the performance of ADAS intelligent driving assistance systems and provide users with a safer and smarter driving experience.