Samsung Electronics expands investment to strengthen semiconductor packaging business

Samsung Electronics is increasing investment in its domestic and overseas production bases to strengthen its advanced semiconductor packaging business. As the importance of internal packaging processes for next-generation high-bandwidth memory (HBM) products, such as HBM4, increases, Samsung is working to enhance its packaging capabilities to ensure future technological competitiveness and narrow the gap with SK Hynix. According to industry sources, Samsung Electronics signed an equipment procurement contract in the third quarter to expand its production facilities at its Suzhou Plant (SESS) in China. The contract is worth approximately 20 billion won (104 million yuan). The Suzhou plant is currently Samsung Electronics' only overseas testing and packaging production base, and this move is seen as a choice for innovation in packaging processes and production efficiency.