Puxing Electronics invests 350 million to expand SiC epitaxial wafer production capacity

Puxing Electronics announced an investment of 350 million yuan to expand the production capacity of 6-inch SiC epitaxial wafers. The project plans to build a production line with an area of ​​approximately 4,000 square meters and purchase 116 sets of SiC epitaxial and related equipment. It is expected that after completion, the company will achieve an annual output of 240,000 SiC epitaxial wafers. Puxing Electronics began to develop SiC in 2016 and achieved mass production of 6-inch SiC epitaxial wafers in 2019. At present, the company mainly produces 1200V MOS products, which have passed automotive-grade verification and are used in new energy vehicle main drive modules. Puxing Electronics plans to accelerate the expansion of 8-inch SiC epitaxial and deploy the research and development of fourth-generation semiconductor materials.