Broadcom 3.5D XDSiP product delivery time confirmed

Broadcom revealed that its 3.5D XDSiP products will start shipping in February 2026. Naoki Shinjo, senior vice president and head of advanced technology development at Fujitsu, said that with more than ten years of partnership, Fujitsu and Broadcom have successfully brought multiple generations of high-performance computing ASICs to the market, and Broadcom's latest 3.5D platform enables Fujitsu's next-generation Arm-based 2nm processor FUJITSU-MONAKA to achieve high performance, low power consumption and low cost.