Micron announces next-generation HBM4 and HBM4E process progress, expected to be mass-produced in 2026

Micron recently announced that its next-generation HBM4 and HBM4E processes have made significant progress and are expected to begin mass production in 2026. HBM4 will stack up to 16 DRAM chips, with each chip having a capacity of 32GB and using a 2048-bit wide interface, providing higher performance than the previous generation. Micron said that with its solid foundation and continued investment in mature 1β (fifth generation 10nm technology) process technology, HBM4 will maintain its leading position in time to market and energy efficiency, with performance improved by more than 50% over HBM3E. It is expected that HBM4 will be launched in large quantities in 2026. In addition, Micron also revealed that HBM4E will be launched soon after, providing customers with the option of customizing logic basic chips and promoting a paradigm shift in the memory business.